SS-2004 Thermally Conductive Gap Filler - Bergquist 2000 Offset

SS-2004 Thermally Conductive Gap Filler - Bergquist 2000 Offset

Grouped product items
Size Price Quantity
50 Ml Dual Syringe
$24.52
400 Ml Dual Syringe
$65.24
1 Lb Kit
$34.70
1 Gallon Kit 24 Lbs
$736.07
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Product Description

SS-2004 is a high performance thermally conductive liquid gap filling material. It is formulated to develop a soft, form in place elastomer, ideal for coupling hot PC board components to heat sinks. This thermal filler is supplied as a two part, 1:1 mix ratio silicone that cures at room temperature, or when exposed to heat it will cure in 5 minutes. A dispensing gun is required for the dual syringes on this bergquist gap filler.

Product features

  • No odor or byproducts
  • Convenient 1:1 mix ratio
  • High 2.0 W/m-K thermal conductivity

Typical Applications

  • Electronic component thermal dissipation
  • Coupling electronic components
  • Form in place heat sink