| SS-2004 |

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Product Description

SS-2004 is a high performance thermally conductive liquid gap filling material.  It is formulated to develop a soft, form in place elastomer ideal for coupling hot PC board components to heat sinks.  It is supplied as a two part, 1:1 mix ratio silicone that when mixed, cures at room temperature, or when exposed to heat results in a cured elastomer in 5 minutes. 

Product Features

• 100% solids liquid
• No odor or byproducts
• Convenient  1:1 mix ratio
• High 2.0 W/m-K thermal conductivity

Typical Applications

• Electronic component thermal dissipation
• Coupling electronic components
• Form in place heat sink

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